Electroplated Ceramics, a ceramic electroplating craftsmanship, including a ceramic body, which is characterized in that there is a glaze layer sintered on the outer surface of the ceramic body, a layer of glue is coated on the local surface of the glaze layer, a layer of glass sand layer is bonded on the surface of the glue layer, a metal layer is electroplated on the entire outer surface of the handicraft, and a pigment layer is provided on the surface of the metal layer; In order to highlight the appearance effect, the ceramic body can be designed as a partial protrusion or concave according to the desired pattern, and the glue layer and the glass sand layer are successively disposed on the outer surface of the non-protruding or non-concave part. The pattern design of the utility model is simple and has a strong sense of three-dimensionality, which greatly enriches the beauty of ceramic crafts.
The surface electroplating process of electroplating ceramic crafts is divided into thin film circuit process and thick film circuit process.
The ceramic electroplating process is actually made of electronic ceramics as the base material, which can be made into various shapes. The characteristics of high temperature resistance and high electrical insulation performance of ceramics are the most prominent, and the advantages of low dielectric constant and dielectric loss, large thermal conductivity, good chemical stability, and similar thermal expansion coefficient of the component are also very significant.
Ultra-fine line circuit patterns are produced on ceramic substrates by magnetron sputtering, patterned lithography, dry wet etching, and electroplating thickening process. In the thin-film process, based on the thin-film circuit process, the surface of the ceramic is metallized by magnetron sputtering, and the thickness of the copper layer and gold is greater than 10 microns or more by electroplating.